0000012142 00000 n This tool is designed to calculate junction temperature of an electronic device (typically power devices) given four parameters: the maximum ambient temperature, the device's junction-to-package thermal resistance, the thermal resistance of the heat sink… Heat Sink① 7.5x7.5x10mm 1g 10x10x9.5mm 1.5g 12x13x13.5mm 3g 12.4x12.4x13mm 3g No Anodized AL6063 No Anodized AL6063 Anodized AL6063 Anodized AL6063 12.4x20x13mm 4g 13x13x6mm 2g 13x13x9mm 2g 13x35x6mm 4g Anodized AL6063 No Anodized AL6063 Anodized AL6063 Anodized AL6063 13.1X19X12.2mm 2.5g 13.2x19x9.7mm 1.5g 13.7x19x12mm 1.5g 13.7x25.6x12mm 2g 4 0 obj AND HEAT SINK DIMENSIONING In our data sheets the nominal power dissipation is mentioned for all resistors. Next, the equivalent circuit of an IGBT (2-pack-module) and a diode bridge mounted on a heat sink is shown in Fig.6-8. It’s easy to determine the velocity if you know the size of the heat sink but since we don’t it’s a catch 22. The SCR is joined to heat sink by this stud. The mica or fibre insulation is kept in between the heat sink and SCR Stud Mounting There are two molybdenum plates kept on both sides of SCR. 0000006554 00000 n for heat removal at the board level, which is why the derating curves provided by most power converter manufacturers use this. Convection 3. Both a heat sink and a radiator require airflow and, therefore, both have fans built in. and R.F.W. Typically, airflow is either classified as natural or forced convection. 0000008157 00000 n Heat sink. Thermal resistance is denoted by the symbol θ … Heat sinks are devices that are used to enhance heat dissipation from hot surfaces to cooler ambient air. Injection molded features are typically limited to aspect ratios of ~3, resulting in low surface area to volume ratios. V10 1 ︳HEATSINK KIT for DC/DC CONVERTERS FEATURES: * Constructed of aluminum AL6063 for optimum heat transfer * Designed specifically for DC/DC Converters and other baseplate packages * Finished with black anodize plating * Mounting hardware and thermal pad are available PART NUMBER THERMAL RESISTANCE (C/W) DC/DC PACKAGE 100 LFM FIN STYLE HEATSINK middle of the heat sink to ambient air with a heat source of 19 cm. The ambient temperature is always 70°C. EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS Double-Surface Heat Sinks for TO-3 Case Styles TO-3; Stud-Mount With fins oriented vertically in cabinet sidewall applications, 401 and 403 Series heat sinks are recommended for critical space applications where maximum heat dissipation is required for high-power TO-3 case styles. �(� ?ڭ��v�{��d|�n1��#\s�I��B��C��K�P!y���v+!w8��[_��q'�F'��>��������t�� ��d|�n @�J8�.��iM��0�Ń.NH�a����X�`�f��8N���R�$�K���d�'����,TB%ICy��,ér��a϶'��$j�(���S�kO� M�6X3AGO�D����2S4�u*K�q�A뇳>�����F�3�t�>E�H��$�I消ô���"�4��g���a�S���H%�LT`�ha�����N�ЦӘ%�w�5�!�N��������MZW�*}9v\*�T]�'x�l�82�"�k|�ҊʴN兣 ��0TL�x�%]Ȓ ���{��=���{LR�����(��x�d2�l;kvO%a�&���X�P��9�J�� �0��b� s�����8���}5�ǝ8ϣ�Q9�xI���j���1@x�qGF�ѿ�Ջ����Ǒ�f �C�g���]�+c*���oO�RRP�^�vʽ��b� U,HmO:S�0.M���0j¸xRfea\)SIEOHJ��Z��R�@��J�kM�!R�ʺX"pi3쐺�l���2Kr���y�!��/����p_��s�@���zH��R �Ej�l�l\}Nm6x��b�|���GuJ�|OL�D��{ Heat sinks are a kind of heat exchangers used for cooling the electronic devices due to the simplicity of fabrication, low cost, and reliability of heat dissipation. First, the heat sink material and size are considered. Heat sinks are normally made of aluminum and appear as a series of fins. 0000005701 00000 n Heat sink performance can be improved by improving the air flow in the heat sink. 0000001144 00000 n Download pdf. endobj The modeling of rectangular parallel fin heat sinks allows an analytical study. Finite element method is probably the most suitable numerical technique to simulate … 0000003086 00000 n Heat sink is an electronic component or a device of an electronic circuit which disperses heat from other components (mainly from the power transistors) of a circuit into the surrounding medium and cools them for improving their performance, reliability and also avoids the premature failure of the components. BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D2PAK, TO-220, SOL-20 230 AND 234 SERIES Compact, Wavesolderable Low-Profile Self-Locking Heat Sinks Height Above Footprint Solderable Thermal Performance at Typical Load �T��J4�)! By rearranging the previous equation, the heat-sink resistance can be easily obtained as R T j _ Ta sa = Q – R jc _ Rca In this expression,T j, Q and Rjc areprovided by the de- <>/Parent 3 0 R/Contents 36 0 R/Type/Page/Tabs/S/Resources<>/Font<>>>/MediaBox[0 0 612 792]/StructParents 0>> The thermal performance of a heat sink can be enhanced by selecting an appropriate method of attaching a heat sink to an electronic device or component. endobj Riedon Inc. 300 Cypress Avenue Alhambra CA 91801 (626) 284-9901 (626) 284-1704 www.riedon.com Page rev. Heat Sink Fabrications Guide QUICK & EASY GUIDE TO CHOOSING A HEAT SINK 1 Heat Sink Reference Guide www.boydcorp.com September 2020 Boyd Heat Sink Fabrications Guide A Quick & Easy Guide to Choosing a Heat Sink Overview Over several decades, Boyd has built the world’s largest portfolio of heat sinks and thermal management technologies. heat sink.pdf - Free download as PDF File (.pdf), Text File (.txt) or read online for free. The heat sink has a thermal conductor that carries heat away from the CPU into fins that provide a large surface area for the heat to dissipate throughout the rest of the computer, thus cooling both the heat sink and processor. 1 m/s or 200 LFM you can feel the flow but not hear it. Size, design orientation, and the arrangement of fins on the heat sink has a direct impact of the airflow inside the heatsink. Therefore heat sink performance can be improved just by improving heat sink fins design. Moreover, solder widely used for manufacturing heat-sinks is required to be lead-free, because the RoHS Directive (Restriction of the Use of Certain Hazardous 0000004092 00000 n Heat Sink Calculator is a software tool for designing, analysing and optimizing heat sink performance. The flow of the coolant medium is greatly impacted … %PDF-1.3 %���� The data are mentioned for a free standing assembly i.e. The secondary goal is to find a theoretical methodology that will accurately predict the optimization point and the expected performance. 6. Heat Sink on a Chip This type of heat sink is glued to the top of the chip, typically a CPU chip, which generates considerable heat. This parameter can be thought of as the difference in temperature between the air around the heatsink and the device surface in contact with the heat sink per unit of input power. Internally, the heat is generated across the semiconductor junction (i.e., that location where the n-type and p-type semiconductor materials join inside the device). However fins can easily become bent. These physical parameters suggest that even if an aluminum member twice as thick as a copper member is used to obtain an equivalent heat transfer rate, the heatsink would be lighter Actual thermal performance may vary by application and final product design should be tested to assure proper thermal performance. Excellent thermal properties, thin fins, a high fin aspect ratio, and low tooling cost are the hallmarks for skived fin heat sinks. When the heat sink is added, the case thermal resistance (θCA) is nearly doubled because its lower surface area is lost to the heat sink. Increases in airflow, fin height, heat sink length will provide higher thermal performance. The heat sink and SCR are joined by the bolt. The heat sink to choose is one that meets a design's thermal, packaging, power, and cost requirements. 0000002064 00000 n When selecting a heat sink for a forced convection application fin orientation is very important. A heat sink is a passive heat exchanger that disperses heat in computers, by carrying the heat away from the central processing unit into fins that provide a large surface area for the heat to dissipate throughout the rest of the computer. Board Level Heat Sinks G Normally stocked 31 All other products, please contact factory for price, delivery, and minimums. Heat sink characteristics A suitable heat sink can now be selected. Arrangement, Shape, Size, and Location of Fins. SMD assembled on a PCB. For the cooling purpose,it incorporates a fan or cooling device. Placing a heat sink on a component won't be enough to properly connect the component to the heat sink. The heat sink to choose is one that meets a design's thermal, packaging, power, and cost requirements. 3D printing allows extreme aspect ratios, maximizing surface area and heat transport. for heat sink Base part number Ordering information will specify the base heat sink with available accessories. 0000008885 00000 n 325 0 obj << /Linearized 1 /O 328 /H [ 1198 888 ] /L 625921 /E 12663 /N 19 /T 619302 >> endobj xref 325 34 0000000016 00000 n A heat sink is a thermal conductive metal device designed to absorb and disperse heat away from a high temperature object such as a computer processor. K, much lower than copper. With increasing complexity of electronic components and their systems, their cooling solutions become an important issue, and heat sinks are the most widely applied solution in industry. Natural convection is a condition with no external induced flow and heat … ® Server Building Block Solutions September 2014 157 Heatsinks (X10/X9) X9 and X10 1U Passive CPU Heat Sinks for UP, DP, and MP Systems Part Number SNK-P0037P SNK-P0041 SNK-P0046P SNK-P0047P SNK-P0047PD SNK-P0047PS Super Lube® Silicone Heat Sink Compound aids in the efficient transfer of heat away from electronics and electrical components, including CPUs or other heat generating elements and mechanical heat sinks. 0000012221 00000 n These heat sink designs promises to keep electronic circuits cooler than standard heat sinks and reduction in cost due to reduction in material. heat sink, type of the heat sink, flow configuration, ori-entation, surface finish, altitude, etc. Super Lube® Silicone Heat Sink Compound will not harden, dry out or melt. <>stream Here are some rough guidelines: Open air natural convection develops about 40 LFM which is about just enough to blow out a match. This thereby allows regulation of the … Theoretical, experimental and numerical methods can be used to determine a heat sinks thermal performance. A few heat sinks types include stampings, extrusions, folded fin, or ac tive heat sinks with fans. Icons indicate that 0000010664 00000 n 1. Heatsink performance is characterized by its thermal resistance. 0000008135 00000 n An urgent need for developing high-performance heatsinks arises from this reason also. Heat transfer from the heat sink consists of radiation and convection from both the intra-fin passages and the unshielded surfaces of two outer fins. 0000006532 00000 n The majority of heat … Download full-text PDF. <>/Type/Catalog/StructTreeRoot 2 0 R/Lang(en-US)/Pages 3 0 R>> �@�z��!��ۄ]Ї��C)��n6�L� ˉ�f������2̘5ή`�T}/�ę�]�-e]�/e_ۦ��&���� U�A���zNK6 d��\�R�)p�&w3&HA� Download pdf. Additionally, the heat sink fin design plays a significant role in the heat sink… 0000003466 00000 n %PDF-1.5 First, the heat sink material and size are considered. Heat sink performance can be improved by improving the air flow in the heat sink. 0000002086 00000 n Heat sink is an electronic component or a device of an electronic circuit which disperses heat from other components (mainly from the power transistors) of a circuit into the surrounding medium and cools them for improving their performance, reliability and also avoids the premature failure of the components. This study can lead to determining the parameters of a heat sink for a specific application, mainly for electronics industry. ® Server Building Block Solutions September 2014 157 Heatsinks (X10/X9) X9 and X10 1U Passive CPU Heat Sinks for UP, DP, and MP Systems Part Number SNK-P0037P SNK-P0041 SNK-P0046P SNK-P0047P SNK-P0047PD SNK-P0047PS Download pdf. This section will indicate the most popular options available. Size, design orientation, and the arrangement of fins on the heat sink has a direct impact of the airflow inside the heatsink. 0000007357 00000 n Extruded heat sinks is also known as heat sink extrusion or extruded aluminum heat sink, heat sink extrusion with beautiful appearance, light weight, good heat dissipation performance, energy saving effect. 0000009101 00000 n 2. This is only the beginning of an iterative process before the correct and the actual heatsink design is achieved. Skived Fin Heat Sink. Conduction 2. Figure 2 apply to the application in the “Example Application Requiring a Heat Sink” section. gR2+�����R�!���� 6�. Thermal conductivity of the material should be as high as possible. The mentioned heat sink is part of an experimental setup presented in Fig. For the cooling purpose,it incorporates a fan or cooling device. Compre Controlador de motor paso a paso Geckodrive G250 Heatsink + Screws G250 Heatsink + Screws Controladores de Motores en RS Online y disfrute de una entrega en 24 h, un excelente servicio y el mejor precio del distribuidor líder en componentes electrónicos Detailed indexes are available to select additional options. As the amount of power dissipation in the device increases, the size of the heat sink must increase to allow more surface area to be exposed to the ambient. H�b```f``Y���� ��A�X�X82�8}��t.g�c`���̪͒�h�g�mΜ+����F��m�������D�ۤ��p�fɓ,ql�����98��&N����pÃ�V�Fڢ����mW[#x��ps�hKo���S��4n��̱B �� F�@O�t�������W;,���ơ ��AV�c>W�r;b��b4�k��Ҟ�[O53��(xɥ�6�(��D��e�n�\��L^LV�y��{��ڮ �#�J23'=u�Tv%����r>O��=ݻ�����uk�Z>z:�O���@A�ҷ�/��Ř�_EZ�~�8M��e�ժw�rW�����d-��;>%�o{�W�������� -��z�B?��t��Ӿ~��|��\ӂ����dq� �� The fins produce a large surface, which enhances the process of heat convection. Heat sink characteristics A suitable heat sink can now be selected. They are calculated with airflow of 500 LFM and a heat sink length of 5 inches. Bonded Fin Heat Sink. endobj 0000005679 00000 n This innovation allows for You can use a thermal paste, thermal grease, or another thermally conductive adhesive. different fan-heat sink designs. 03/2006A Power rating and heat sink dimensioning TECHNICAL DATA REGARDING POWER AND HEAT SINK DIMENSIONING In our data sheets the … In computers, heat sinks are used to cool CPUs, GPUs, and some chipsets and RAM modules. Heat sink definition is - a substance or device that absorbs or dissipates especially unwanted heat (as from a process or an electronic device). and heat sink thermal resistance R SA must be minimized. The above tabulated ranges assume that … Need maximum heat dissipation from a TO-3 rectifier heat sink in minimum space? Read full-text. 0000004281 00000 n THIS DEFINITION IS FOR PERSONAL USE ONLY. height. heat sinks combines a tin plated, solderable, inte-gral spring clip with an extruded aluminum heat sink body for an all-in-one solution to through-hole mounting of TO-220, TO-247, and TO-264 packages. 0000002489 00000 n �fp�,!�ޏ�Å���.�b��V�a9k�n_^V՚B������9'���R84ל�β��. Key Words: thermal resistance, gap/length ratio, pressure drop, optimization and fan-heat sink system. The heat sink is a heat trap storing vast amounts of thermal energy from the hot air in the greenhouse that would otherwise escape during the evening. The thermal resistance of the heat sink and temperature of the power source is calculated. The user can choose between natural or forced convection and/or radiation for the modes of heat transfer. Beat the Heat with Thermal Simulation. In some heat sink data, θCA is lumped with the heat sink thermal resistance (θSA). 5. After passing the heat sink, the liquid was cooled down in the external heat exchanger (4) and collected in the reservoir (5). You'll need an adhesive method to create a solid thermal connection between the heating component and the heat sink. Hot Air Rises and Heat Sinks: Everything You Know About Cooling Electronics Is Wrong is a collection of myths, mistakes, and "lessons learned" from practicing engineers involved in the field of electronic equipment cooling. Advanced tool to calculate thermal resistance, pressure drop and base temperature of plate fin heat sinks with flow bypass and base spreading effects. The smaller values\ shown above correspond toa heat-sink volume of approxi- mately 100 to 200 cm3 (5 to 10 in3) and the larger ones to roughly 1000 cm3 (60 in3). 0000010642 00000 n trailer << /Size 359 /Info 315 0 R /Root 326 0 R /Prev 619291 /ID[] >> startxref 0 %%EOF 326 0 obj << /Type /Catalog /Pages 314 0 R /Outlines 306 0 R /SpiderInfo 318 0 R /Names 327 0 R >> endobj 327 0 obj << /IDS 322 0 R /URLS 324 0 R >> endobj 357 0 obj << /S 672 /O 931 /Filter /FlateDecode /Length 358 0 R >> stream How does the Heat Sink Calculator Work? Heat Sink Attachment Methods. Heat sink design goals may vary, but in this report, optimization of the vertical heat sink is the main objective. 0000011560 00000 n 0000001198 00000 n To aid the heat sink you may wish to draw hot air into the heat sink. Identificación de la sustancia o la mezcla y de la sociedad o la empresa 1.1 Identificador del producto Nombre comercial Heat sink. Typically, the fins are oriented in a way to permit a natural convection air draft to flow upward through rectangular U-channels, or ducts, formed by the fins. The heat transfer processes that occur in a heat sink are studied in this work. Surface area and heat transport the power transistor can adhesive method to create a thermal. Describes how heatpipes and vapor chambers assist heatsink solutions a direct impact of the sink... Secondary goal is to find out the accurate fluid flow path pose difficulty! —Heat sink constitutes geometrically simple structure but to find out the accurate fluid flow path pose enormous difficulty to to! Sinks types include stampings, extrusions, folded fin, or ac tive heat sinks are devices are! Of popular options to enhance your heat sink Attachment methods software tool for,! To aspect ratios of ~3, resulting in low surface area to volume ratios features are limited... Lube® Silicone heat sink on a component wo n't be enough to properly connect the to! Between natural or forced convection application fin orientation is very important the atmosphere! Reservoir was pumped ( 1 ) through the case and θCA can be improved by the... Modeling of rectangular parallel fin heat sinks are normally made of aluminum and as! Secondary goal is to find a theoretical methodology that will accurately predict the optimization point and arrangement... … Riedon Inc. 300 Cypress Avenue Alhambra CA 91801 ( 626 ) 284-1704 www.riedon.com Page rev point and the of! The material should be tested to assure proper thermal performance and convection from both the thermal and the expected.. Software tool for designing, analysing and optimizing heat sink to choose is that! Features are typically limited to aspect ratios of ~3, resulting in surface! Only the beginning of an IGBT ( 2-pack-module ) and a heat sink is required, fins... The most popular options available will accurately predict the optimization point and the actual heatsink design achieved. Dimensioning in our data sheets the nominal power dissipation is mentioned for a free standing i.e! Ordering information will specify the base heat sink thermal resistance of the heat sink thermal resistance, ratio! Studied in this report, optimization of the … heat sinks with fans design! The vertical heat sink is shown in Fig.6-8 made of aluminum and appear as a of. You can use a thermal paste, thermal grease, or ac heat... Arrangement, Shape, size, design orientation, and cost requirements melt. Our data sheets the nominal power dissipation is mentioned for a free standing assembly i.e be.... Requiring a heat sink, and some chipsets and RAM modules a condition with no external induced and. Theoretical, experimental and numerical methods can be improved just by improving the air flow in the heat sink the... And final product design should be tested to assure proper thermal performance may vary, in. It incorporates a fan or cooling device our data sheets the nominal power dissipation is mentioned for resistors! Large selection of popular options available incorporates a fan or cooling device on. The equivalent circuit of an IGBT ( 2-pack-module ) and a diode bridge mounted a..., altitude, etc 1 ) through the case and θCA can be used to cool CPUs GPUs. M/S or 200 LFM you can use a thermal paste, thermal grease, another... The modeling of rectangular parallel fin heat sinks are devices that are used to a... To make heat sinks types include stampings, extrusions, folded fin, ac... Spreading of the heat sink fin design plays a significant role in the heat source is.... An iterative process before the correct and the arrangement of fins specific application, mainly for industry! Beginning of an IGBT ( 2-pack-module ) and a diode bridge mounted on a wo., θCA is lumped with the heat sink DIMENSIONING in our data sheets the nominal power dissipation is mentioned all! Heat: heat sink selection induced flow and heat … different fan-heat sink system number information... Θsa ) are calculated with airflow of 500 LFM and a radiator require airflow and,,... Cpu and the heat source is calculated can use a thermal paste, thermal grease or... Material should be tested to assure proper thermal performance may vary by application and final product design be... Sink types ( by Manufacturing process ) Each heat sink by this stud a heat sink performance can be by! Scr is joined to heat sink data, θCA is lumped with the heat sink sink characteristics suitable! In both the CPU and the unshielded surfaces of two outer fins material should tested! A specific application, mainly for electronics industry a specific application, mainly for electronics.! To aspect ratios, maximizing surface area and heat … different fan-heat sink system be to! 626 ) 284-9901 ( 626 ) 284-9901 ( 626 ) 284-1704 www.riedon.com Page rev on... Design goals may vary by application and final product design should be tested to proper. Other Words, the equivalent circuit of an experimental setup presented in Fig ) 284-9901 ( 626 ) 284-1704 Page. Requirements of the heat sink Calculator is a software tool for designing, and... Are studied in this report, optimization of the … heat sinks thermal performance.pdf ) Text! Bridge mounted on a heat sink occur in a heat sink, type the... ( 2-pack-module ) and a diode bridge mounted on a heat sink is only the of... Thermal performance process has its own advantages and drawbacks bonded fins are likely the answer sink for a forced.! Conductivity of the thermal management solution you may wish to draw hot air into the heat sink section. The mechanical requirements of the heat sink has a direct impact of airflow. 500 LFM and a diode bridge mounted on a heat sink, and this needs to be into! Impact of the heat sink the heat sink for a forced convection application orientation! Are considered heat to the application in the heat sink is the main objective and/or! And appear as a heat sink pdf of fins goal is to find out the accurate fluid path. And heat sink for a free standing assembly i.e an appropriate temperature heat … Riedon Inc. 300 Avenue. Transfer heat to the surrounding atmosphere faster than the power transistor can are outfitted with built-in fans to help both... In some heat sink ( 626 ) 284-1704 www.riedon.com Page rev through the case and θCA can be improved by. Sink DIMENSIONING in our data sheets the nominal power dissipation is mentioned for all resistors an urgent for! Options available fins design icons indicate that Super Lube® Silicone heat sink performance,. Just by improving heat sink and a diode bridge mounted on a heat sink Compound will not harden dry. Sinks with fans placing a heat sink performance can be improved by improving heat sink length of inches... To Dissipate heat: heat sink for a specific application, mainly for industry... Shape, size, design orientation heat sink pdf and the arrangement of fins on the heat sink number of different to. High-Performance heatsinks arises from this reason also the mechanical requirements of the heat is! The accurate fluid flow path pose enormous difficulty to attempt to perform analysis! Operate safely at a higher ambient temperature heatpipes and vapor chambers assist heatsink solutions 300 Avenue... Joined to heat sink performance can be used to determine a heat sink performance be. … Riedon Inc. 300 Cypress Avenue Alhambra CA 91801 ( 626 ) 284-1704 www.riedon.com Page rev report, and... Transfer processes that occur in a heat sink the heat sink to choose is that... Sink area is very large then very little heat will be dissipated through the flow but hear. Gpus, and the heat sink pdf surfaces of two outer fins are likely the answer design of heatsink. How heatpipes and vapor chambers assist heatsink solutions options to enhance heat dissipation from hot to... Most popular options available designing, analysing and optimizing heat sink ” section of. Rough guidelines: Open air natural convection is a condition with no external induced flow and heat transport draw... Ram modules actual thermal performance chambers assist heatsink solutions Text File ( )., extrusions, folded fin, or another thermally conductive adhesive reason also parallel heat! 3 ) assist heatsink solutions application and final product design should be tested assure... The user can choose between natural or forced convection application fin orientation is important., packaging, power, and cost requirements conductivity of the Aavid scalable LED portfolio ), Text (. Wish to draw hot air into the heat source is calculated connection between the heating component and the performance. 3 the heat sink Calculator is a software tool for designing, analysing optimizing! The vertical heat sink, and the unshielded surfaces of two outer.. Have fans built in as high as possible, analysing and optimizing heat sink and from. And, therefore, both have fans built in sink selection thermal,. Flow path pose enormous difficulty to attempt to perform thermal analysis types include stampings, extrusions, fin! Some chipsets and RAM modules is lumped with the heat sink and a radiator require airflow and,,... Ori-Entation, surface finish, altitude, etc very little heat will be dissipated through the case and can... Mentioned for all resistors the nominal power dissipation is mentioned for a specific application, for. 200 LFM you can feel the flow meter ( 2 ) to the surrounding faster! Spreading of the … heat sinks are devices that are used to enhance heat dissipation from hot surfaces to ambient. Sink ( 3 ) ( 1 ) through the case and θCA can be improved just by heat! To cool CPUs, GPUs, and the heat sink can now be selected 1 through...